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发表于: 2019-7-28 21:40:53 | 只看该作者 |只看大图 |倒序浏览

SD-GP1.2-SP is a silicone pad that maintains optimal thermal performance. With the Sil-pad reinforcement carrier, it allows easy handling and high compression performance. The material is ideal for applications requiring low stress on components and boards during assembly. The natural tack on one side of the material allows for good compliance to adjacent surfaces of components, minimizing??interfacial resistance.

Features and Benefits
? Thermal conductivity: 1.2 W/m·K
? Extreme compliancy
? Conformable, low hardness
? Electrically isolating
? Fiberglass reinforced for puncture, shear and tear resistance
Typical Applications Include:
? Telecommunications
? Notebook and desktop computers
? Power conversion
? Flat panel display
? Automotive electronics
? Optical disk drives
? Memory modules
TYPICAL PROPERTIES
PHYSICAL
TYPICAL RESULTS
TEST METHOD
Color
White
Visual
Reinforcement Carrier
Dark red SD-SP
-
Thickness Range
0.5 to 6 mm
ASTM D374
Density
1.8 g/cc
ASTM D792
Hardness (Shore 00)
25
ASTM D2240
ELECTRICAL
Dielectric Breakdown Voltage @1mm
> 6KV
ASTM D149
Dielectric Constant (1MHz)
6
ASTM D150
Volume Resistivity (Ω·m)
1011
ASTM D257
Flame Rating
V-0
UL 94
THERMAL
Thermal Conductivity (W/m·K)
1.2
ASTM D5470
Thermal Impedance, 1.5mm, 10 psi
2.2 °C·in.2/W
ASTM D5470
Weight Loss, 24hrs@200°C
< 1%
Continuous Use Temp.
-45°C to 160°C
-



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