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发表于: 2019-7-28 21:36:16 | 只看该作者 |只看大图 |倒序浏览

SD-GP3.2 is a 3.2 W/m·K soft gap filler thermal interface material with great thermal performance and high compliancy. SD-GP3.2 is well suited for high performance in low-stress applications. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness or topography.

Features and Benefits
? Thermal conductivity: 3.2 W/m·K
? Soft and highly compliant
? Low thermal resistance at low pressure
? Naturally tacky for easy assembly
Typical Applications Include:
? Semiconductors to heat sink
? Telecommunications equipment
? Consumer electronics
? LCD and PDP flat panel TV
TYPICAL PROPERTIES
PHYSICAL
TYPICAL RESULTS
TEST METHOD
Color
Light Red
Visual
Reinforcement Carrier
None
-
Thickness Range
0.5 to 6 mm
ASTM D374
Density
3.0 g/cc
ASTM D792
Tensile strength
0.08Mpa
ASTM D412
Hardness (Shore 00)
40
ASTM D2240
ELECTRICAL
Dielectric Breakdown Voltage @1mm
> 6KV
ASTM D149
Dielectric Constant (1MHz)
5.5
ASTM D150
Volume Resistivity (Ω·m)
1011
ASTM D257
Flame Rating
V-0
UL 94
THERMAL
Thermal Conductivity (W/m·K)
3.2
ASTM D5470
Thermal Impedance @1mm, 20psi
0.35 °C·in.2/W
ASTM D5470
Continuous Use Temp.
-50°C to 180°C
-

Data sheet

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