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发表于: 2019-7-28 21:08:42 | 只看该作者 |只看大图 |倒序浏览

SD-GP2.3 is recommended for low- stress applications that require a mid to high thermally conductive interface material. “S-Class” is ultra soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.


Features and Benefits
? Thermal conductivity: 2.3 W/m·K
? “S-Class” for ultra soft hardness
? Designed for low-stress applications
? Excellent adhesive properties
Typical Applications Include:
? Semiconductors to heat sink
? Telecommunications equipment
? Consumer electronics
? LCD and PDP flat panel TV

TYPICAL PROPERTIES
PHYSICAL
TYPICAL RESULTS
TEST METHOD
Color
Light Yellow
Visual
Reinforcement Carrier
None
-
Thickness Range
0.5 to 6 mm
ASTM D374
Density
3.0 g/cc
ASTM D792
Tensile strength
0.07Mpa
ASTM D412
Hardness (Shore 00)
35
ASTM D2240
ELECTRICAL
Dielectric Breakdown Voltage @1mm
> 6KV
ASTM D149
Dielectric Constant (1MHz)
5.3
ASTM D150
Volume Resistivity (Ω·m)
1011
ASTM D257
Flame Rating
V-0
UL 94
THERMAL
Thermal Conductivity (W/m·K)
2.3
ASTM D5470
Thermal Impedance @1mm, 20psi
0.50 °C·in.2/W
ASTM D5470
Continuous Use Temp.
-50°C to 180°C
-

Data sheet


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发表于: 2019-8-2 08:48:37 | 只看该作者

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