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发表于: 2019-7-28 20:59:18 | 只看该作者 |只看大图 |倒序浏览

SD-GP4.9 is a thermally conductive, reinforced material rated at a thermal conductivity of about 5 W/m·K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
SD-GP4.9 is naturally tacky, and no adhesive coating is required, to provide easy handling and converting process.


Features and Benefits
? Thermal conductivity: 4.9 W/m·K
? Soft and highly compliant
? Low thermal resistance at low pressure
? Excellent adhesive properties
Typical Applications Include:
? Semiconductors to heat sink
? Telecommunications equipment
? Consumer electronics
? LCD and PDP flat panel TV

TYPICAL PROPERTIES
PHYSICAL
TYPICAL RESULTS
TEST METHOD
Color
Rose gold
Visual
Reinforcement Carrier
-
-
Thickness Range
0.5 to 6 mm
ASTM D374
Density
3.2 g/cc
ASTM D792
Tensile strength
0.06Mpa
ASTM D412
Hardness (Shore 00)
50
ASTM D2240
ELECTRICAL
Dielectric Breakdown Voltage @1mm
> 6KV
ASTM D149
Dielectric Constant (1MHz)
5.0
ASTM D150
Volume Resistivity (Ω·m)
1011
ASTM D257
Flame Rating
V-0
UL 94
THERMAL
Thermal Conductivity (W/m·K)
4.9
ASTM D5470
Thermal Impedance @1mm,20psi
0.31 °C·in.2/W
ASTM D5470
Continuous Use Temp.
-50°C to 180°C
-

Data sheet





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