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发表于: 2019-7-28 20:55:53 | 只看该作者 |只看大图 |倒序浏览


D-GP1.0-SP is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. SD-GP1.0-SP is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
Features and Benefits
? Thermal conductivity: 1.0 W/m·K
? Highly conformable, low hardness
? “Gel-like” modulus
? Decreased strain
? Puncture-, shear- and tear-resistant
? Electrically isolating
Typical Applications Include:
? Telecommunications
? Computer and peripherals
? Power conversion
? Between heat-generating semiconductors and a heat sink
? Area where heat needs to be transferred to a frame, chassis, or other types of heat spreader

TYPICAL PROPERTIES
PROPERTY
TYPICAL RESULTS
TEST METHOD
Color
White/red
Visual
Reinforcement Carrier
Dark red SD-SP
-
Thickness Range
0.5 to 6 mm
ASTM D374
Density
2.1 g/cc
ASTM D792
Hardness (shore00)
10
ASTM D2240
ELECTRICAL
Dielectric Breakdown Voltage @1mm
􏰀6KV
ASTM D149
Dielectric Constant (1MHz)
5.5
ASTM D150
Volume Resistivity (Ω·m)
1011
ASTM D257
Flame Rating
V-0
UL 94
THERMAL
Thermal Conductivity (W/m·K) 1.0
ASTM D5470
Thermal Impedance, 10 psi
1.87 °C·in.2/W
ASTM D5470
Weight Loss, 24hrs@200°C
< 1%
Continuous Use Temp.
-40°C to 160°C
-





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