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公告 公告: 招募版主 admin 2019-7-28
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隐藏置顶帖 预览 全局置顶 德国大陆纯电动汽车永磁同步电机控制器拆解图(包括DCDC部分) attach_img digest
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隐藏置顶帖 预览 全局置顶 Viscosity testASTMD2196-2005旋转(布鲁克菲尔德)粘度计测定非牛顿材料流变特性 新人帖 attach_img digest
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隐藏置顶帖 预览 全局置顶 热传导网_恭喜成功位列百度搜索第一页 attach_img
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隐藏置顶帖 预览 全局置顶 热传导、亚博体育官网阿根廷合作伙伴、热传导材料与亚博体育官网阿根廷合作伙伴材料名称的区别 attach_img digest
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隐藏置顶帖 预览 全局置顶 贝格斯 精华原版资料 gapfiller material介绍 attach_img
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隐藏置顶帖 预览 全局置顶 ASTMD5470-12 Standard Test Method fo rThermalTrans attach_img
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隐藏置顶帖 预览 全局置顶 值得收藏 | 几种常见亚博体育官网阿根廷合作伙伴材料优缺点对比 digest
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隐藏置顶帖 预览 全局置顶 密封圈设计讨论 精华 attach_img
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预览 诗朵:SD-GP4.9 attach_img
SD-GP4.9 is a thermally conductive, reinforced material rated at a thermal conductivity of about 5 W/m·K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms we ...
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预览 诗朵: SD-GP3.9 attach_img
SD-GP3.9 is a thermally conductive, reinforced material rated at a thermal conductivity of about 4 W/m·K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms we ...
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预览 诗朵: SD-GP2.3 attach_img
SD-GP2.3 is recommended for low- stress applications that require a mid to high thermally conductive interface material. “S-Class” is ultra soft for low thermal resistance at very low pressures, and ...
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预览 诗朵:SD-GP3.2 attach_img
SD-GP3.2 is a 3.2 W/m·K soft gap filler thermal interface material with great thermal performance and high compliancy. SD-GP3.2 is well suited for high performance in low-stress applications. And it ...
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预览 诗朵: SD-GP1.2-SP attach_img
SD-GP1.2-SP is a silicone pad that maintains optimal thermal performance. With the Sil-pad reinforcement carrier, it allows easy handling and high compression performance. The material is ideal for ap ...
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预览 诗朵: SD-GP1.0-SP attach_img
D-GP1.0-SP is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and sh ...

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